Driving High-Speed Data Innovation Beyond Bandwidth Limits

In the SoC system integration phase, USB 3.0 Physical Layer (PHY) verification is often the most challenging task. The TalentPros USB 3.0 PHY Board provides high-performance, low-latency translation capabilities, ensuring your design achieves perfect connectivity with various SuperSpeed devices on the market.

• High-speed Signal Integrity: Optimized PCB stack-up and impedance tuning for 5Gbps environments ensure high data link stability.
• Shorten Time-to-market: Provides a plug-and-play USB 3.0 expansion solution, allowing engineers to focus on controller logic and firmware driver development.
• PIPE Standard Interface: Supports the industry-standard PIPE (Physical Interface for PCI Express and USB) to seamlessly interface with USB 3.0 controller IPs within the FPGA.
• Exceptional Quality Assurance: Features high-performance PHY chips and industrial-grade connectors to support long-term, high-intensity physical layer stress testing.